DPI CUREX™ BOND 5G

Description
DPI Curex™ Bond 5G is a 5th Generation Dental Adhesive designed for optimal versatility and performance. It offers the flexibility to be used as an etch-and-rinse or enamel selective-etch adhesive, catering to various clinical techniques. With superior bonding capabilities, it ensures excellent adhesion to both enamel and dentin, providing long-lasting strength and reliability. This adhesive is ideal for achieving durable and effective restorations in both direct and indirect procedures, making it a valuable tool for dental professionals.

Features

• Dual Application Techniques: Compatible with both etch-and-rinse and enamel selective-etch methods, offering flexibility in bonding procedures.
• Superior Adhesion: Provides strong, reliable bonds to dentin and enamel, ensuring the durability of restorations.
• Long-Lasting Bonding Strength: Designed to deliver consistent and enduring performance over time.
• Versatile Usage: Suitable for direct and indirect restorations, simplifying treatment protocols.
• Easy Handling: User-friendly design ensures smooth application and enhanced workflow efficiency.

Indication for Use

• Specifically formulated for the direct bonding of light-cured composite materials, ensuring secure and dependable adhesion.

Presentation

• Packaged in a convenient 5 ml bottle, offering an ample supply for multiple procedures.

DPI Curex™ Bond 5G represents a modern solution for dental bonding, combining ease of use with advanced adhesive technology. Its exceptional bonding strength, adaptability, and reliability make it an essential component for achieving optimal results in restorative dentistry.